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Reliability, Yield, and Stress Burn-In Way Kuo

Reliability, Yield, and Stress Burn-In By Way Kuo

Reliability, Yield, and Stress Burn-In by Way Kuo


$159.33
Condition - Good
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Summary

Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.

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Reliability, Yield, and Stress Burn-In Summary

Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development by Way Kuo

The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: * the economic impact of employing the microelectronics fabricated by in dustry, * a study of the relationship between reliability and yield, * the progression toward miniaturization and higher reliability, and * the correctness and complexity of new system designs, which include a very significant portion of software.

Table of Contents

Preface. 1. Overview of Design, Manufacture, and Reliability. 2. Integrating Reliability into Microelectronics Manufacturing. 3. Basic Reliability Concept. 4. Yield and Modeling Yield. 5. Reliability Stress Tests. 6. Burn-In Performance, Cost, and Statistical Analysis. 7. Nonparametric Reliability Analysis. 8. Parametric Approaches to Decide Optimal System Burn-In Time. 9. Nonparametric Approach and Its Applications to Burn-In. 10. Nonparametric Bayesian Approach for Optimal Burn-In. 11. The Dirichlet Process for Reliability Analysis. 12. Software Reliability and Infant Mortality Period of the Bathtub Curve. Epilogue: Cost-Effective Design for Stress Burn-In. References. Appendices: A. Notation and Nomenclature. B. Failure Modes for Parts. C. Common Probability Distributions. D. Simulation for U-Shaped Hazard Rate Curves. E. Sample Programs. Index.

Additional information

CIN0792381076G
9780792381075
0792381076
Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development by Way Kuo
Used - Good
Hardback
Springer
19980131
394
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
This is a used book - there is no escaping the fact it has been read by someone else and it will show signs of wear and previous use. Overall we expect it to be in good condition, but if you are not entirely satisfied please get in touch with us

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