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Failure Analysis of Integrated Circuits Lawrence C. Wagner

Failure Analysis of Integrated Circuits By Lawrence C. Wagner

Failure Analysis of Integrated Circuits by Lawrence C. Wagner


Summary

This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Failure Analysis of Integrated Circuits Summary

Failure Analysis of Integrated Circuits: Tools and Techniques by Lawrence C. Wagner

This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Table of Contents

Preface. 1. Introduction; L.C. Wagner. 2. Electrical Characterization; S. Frank, et al. 3. Package Analysis: SAM and X-Ray; T.M. Moore, C. Hartfield. 4. Die Exposure; P.D. Ngo. 5. Global Failure Site Isolation: Thermal Techniques; D.L. Barton. 6. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques; E.I. Cole, D.L. Barton. 7. Probing Technology for IC Diagnosis; C.G. Talbot. 8. Deprocessing; D. Yim. 9. Cross-Section Analysis; T. Haddock, S. Boddicker. 10. Inspection Techniques; L.C. Wagner. 11. Chemical Analysis; L.C. Wagner. 12. Energy Dispersive Spectroscopy; P.D. Ngo. 13. Auger Electron Spectroscopy; R.K. Lowry. 14. Secondary Ion Mass Spectrometry, SIMS; K. Evans. 15. Failure Analysis Future Requirements; D.P. Vallett. Index.

Additional information

NPB9780412145612
9780412145612
0412145618
Failure Analysis of Integrated Circuits: Tools and Techniques by Lawrence C. Wagner
New
Hardback
Chapman and Hall
1999-01-31
255
N/A
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